是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | TSSOP, TSSOP8,.19 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 0.91 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 225324 | Samacsys Pin Count: | 8 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | Micro8 | Samacsys Released Date: | 2015-08-10 08:51:33 |
Is Samacsys: | N | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.05 mA | 最大供电电压 (Vsup): | 10 V |
最小供电电压 (Vsup): | 1 V | 标称供电电压 (Vsup): | 2.4 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | COMMERCIAL | 端子面层: | Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 阈值电压标称: | +4.33V |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3 mm |
Base Number Matches: | 1 |
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