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MC26LS32D PDF预览

MC26LS32D

更新时间: 2024-11-21 11:09:43
品牌 Logo 应用领域
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页数 文件大小 规格书
4页 83K
描述
QUAD EIA-422/3 LINE RECEIVER WITH THREE.STATE OUTPUTS

MC26LS32D 数据手册

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Order this document by AM26LS32/D  
QUAD EIA–422/3 LINE  
RECEIVER WITH  
THREE–STATE OUTPUTS  
Motorolas Quad EIA–422/3 Receiver features four independent receiver  
chains which comply with EIA Standards for the Electrical Characteristics of  
Balanced/Unbalanced Voltage Digital Interface Circuits. Receiver outputs  
are 74LS compatible, three–state structures which are forced to a high  
impedance state when Pin 4 is a Logic “0” and Pin 12 is a Logic “1.” A PNP  
device buffers each output control pin to assure minimum loading for either  
Logic “1” or Logic “0” inputs. In addition, each receiver chain has internal  
hysteresis circuitry to improve noise margin and discourage output instability  
for slowly changing input waveforms. A summary of AM26LS32 features  
include:  
SEMICONDUCTOR  
TECHNICAL DATA  
D SUFFIX  
PLASTIC PACKAGE  
CASE 751B  
Four Independent Receiver Chains  
Three–State Outputs  
(SO–16)  
High Impedance Output Control Inputs  
(PIA Compatible)  
Internal Hysteresis – 30 mV (Typical) @ Zero Volts Common Mode  
Fast Propagation Times – 25 ns (Typical)  
TTL Compatible  
PC SUFFIX  
PLASTIC PACKAGE  
CASE 648  
Single 5.0 V Supply Voltage  
Fail–Safe Input–Output Relationship. Output Always High When Inputs  
Are Open, Terminated or Shorted  
6.0 k Minimum Input Impedance  
PIN CONNECTIONS  
V
1
2
3
4
5
6
7
8
16  
15  
14  
+
CC  
Representative Block Diagram  
Inputs A  
+
Inputs B  
Three–State  
Outputs A  
Differential  
Inputs  
Control  
Inputs  
3–State  
Control  
Output  
13 Output B  
3–State  
12  
Output C  
Control  
Output D  
Inputs D  
11  
10  
9
+
Inputs C  
Input  
Network  
+
GND  
Level  
Translator  
Amplifier  
Hysteresis  
ORDERING INFORMATION  
Operating  
Level  
Translator  
Amplifier  
Temperature Range  
Device  
Package  
AM26LS32PC  
MC26LS32D*  
Plastic DIP  
SO–16  
T
A
= 0 to 70°C  
* Note that the surface mount MC26LS32D device uses the same die as in the plastic DIP  
* AM26LS32DC device, but with an MC prefix to prevent confusion with the package suffix.  
Motorola, Inc. 1995  

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