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MC14539BD PDF预览

MC14539BD

更新时间: 2024-02-02 07:52:24
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 复用器
页数 文件大小 规格书
6页 198K
描述
Dual 4-Channel Data Selector/Multiplexer

MC14539BD 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.92
JESD-30 代码:R-XDIP-T16JESD-609代码:e0
逻辑集成电路类型:MULTIPLEXER功能数量:2
输入次数:4端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:CERAMIC封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:5/15 V
认证状态:Not Qualified筛选级别:MIL-STD-883 Class B (Modified)
子类别:Multiplexer/Demultiplexers表面贴装:NO
技术:CMOS温度等级:MILITARY
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

MC14539BD 数据手册

 浏览型号MC14539BD的Datasheet PDF文件第2页浏览型号MC14539BD的Datasheet PDF文件第3页浏览型号MC14539BD的Datasheet PDF文件第4页浏览型号MC14539BD的Datasheet PDF文件第5页浏览型号MC14539BD的Datasheet PDF文件第6页 
SEMICONDUCTOR TECHNICAL DATA  
L SUFFIX  
CERAMIC  
CASE 620  
The MC14539B data selector/multiplexer is constructed with MOS  
P–channel and N–channel enhancement mode devices in a single  
monolithic structure. The circuit consists of two sections of four inputs each.  
One input from each section is selected by the address inputs A and B. A  
“high” on the Strobe input will cause the output to remain “low”.  
This device finds primary application in signal multiplexing functions. It  
permits multiplexing from N–lines to I–line, and can also perform parallel–to–  
serial conversion. The Strobe input allows cascading of n–lines to n–lines.  
P SUFFIX  
PLASTIC  
CASE 648  
D SUFFIX  
SOIC  
CASE 751B  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
Capable of Driving Two Low–Power TTL Loads or One Low–Power  
Schottky TTL Load Over the Rated Temperature Range  
ORDERING INFORMATION  
MAXIMUM RATINGS* (Voltages Referenced to V  
)
SS  
MC14XXXBCP  
MC14XXXBCL  
MC14XXXBD  
Plastic  
Ceramic  
SOIC  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Unit  
V
V
DD  
– 0.5 to + 18.0  
T
A
= – 55° to 125°C for all packages.  
V , V  
Input or Output Voltage (DC or Transient)  
– 0.5 to V  
DD  
+ 0.5  
V
in out  
I , I  
Input or Output Current (DC or Transient),  
per Pin  
± 10  
mA  
in out  
BLOCK DIAGRAM  
P
Power Dissipation, per Package†  
Storage Temperature  
500  
mW  
C
D
14  
A
T
stg  
– 65 to + 150  
260  
2
1
6
5
4
3
B
ST  
X0  
Z
7
T
L
Lead Temperature (8–Second Soldering)  
C
* Maximum Ratings are those values beyond which damage to the device may occur.  
Temperature Derating:  
X1  
X2  
X3  
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
Ceramic “L” Packages: – 12 mW/ C From 100 C To 125 C  
TRUTH TABLE  
Address  
A
Inputs  
Data Inputs  
B
W
9
ST  
Y0  
Y1  
Y2  
Y3  
15  
10  
11  
12  
13  
Outputs  
Z, W  
X3  
Y3  
X2  
Y2  
X1  
Y1  
X0  
Y0  
B
A
ST, ST′  
X
0
0
0
0
X
0
0
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
0
1
X
X
1
0
0
0
0
0
0
1
0
1
V
V
= PIN 16  
= PIN 8  
DD  
SS  
1
1
1
1
1
0
0
1
1
X
X
0
1
0
1
X
X
X
X
X
X
X
X
X
X
0
0
0
0
0
1
0
1
X = Don’t Care  
REV 3  
1/94  
Motorola, Inc. 1995  

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