PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
MC-22212361-X
MCP (MULTI-CHIP PACKAGE) FLASH MEMORY AND SRAM
64M-BIT PAGE MODE FLASH MEMORY AND 4M-BIT SRAM
Description
The MC-22212361-X is a stacked type MCP (Multi-Chip Package) of 67,108,864 bits (4,194,304 words by 16 bits)
flash memory and 4,194,304 bits (262,144 words by 16 bits) static RAM.
The MC-22212361-X is packaged in a 85-pin TAPE FBGA .
Features
General Features
• Fast access time : tACC = 80 ns (MAX.) (VCCf = 1.8 V), 85 ns (MAX.) (VCCf = 1.65 V) (Flash Memory),
tAA = 70 ns (MAX.) (SRAM)
• Supply voltage : -D80X : 1.8 to 2.1 V (Chip) / 2.7 to 3.1 V (I/O) (Flash Memory), 2.7 to 3.1 V (SRAM)
-E85X : 1.65 to 1.95 V (Chip) / 2.7 to 3.1 V (I/O) (Flash Memory), 2.7 to 3.1 V (SRAM)
• Output Enable input for easy application
• Wide operating temperature : TA = −25 to +85°C
Flash Memory Features
• Four bank organization enabling simultaneous execution of program / erase and read
• High-speed read with page mode
• Bank organization : 4 banks (8M bits + 24M bits + 24M bits + 8M bits)
• Memory organization : 4,194,304 words × 16 bits
• Sector organization :
142 sectors (4K words × 16 sectors, 32K words × 126 sectors)
Boot sector allocated to the highest address (sector) and the lowest address (sector)
• 3-state output
• Automatic program
• Program suspend / resume
• Unlock bypass program
• Automatic erase
• Chip erase
• Sector erase (sectors can be combined freely)
• Erase suspend / resume
• Program / Erase completion detection
• Detection through data polling and toggle bits
• Detection through RY (/BY) pin
• Sector group protection
• Any sector group can be protected
• Any protected sector group can be temporary unprotected
• Any sector group can be unprotected
• Sectors can be used for boot application
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M15855EJ3V0DS00 (3rd edition)
Date Published September 2002 NS CP (K)
Printed in Japan
The mark ★ shows major revised points.
2001
©