生命周期: | Obsolete | 包装说明: | FBGA, BGA77,8X14,32 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 85 ns | JESD-30 代码: | R-PBGA-B77 |
内存集成电路类型: | MEMORY CIRCUIT | 混合内存类型: | FLASH+SRAM |
端子数量: | 77 | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA77,8X14,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
子类别: | Other Memory ICs | 最大压摆率: | 0.045 mA |
表面贴装: | YES | 技术: | HYBRID |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MC-222244AF9-B85X-BT3 | NEC | Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77 |
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MC-222254AF9-B85X-BT3 | NEC | Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77 |
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MC-222262F9-B85X-BT3 | NEC | Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77 |
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MC-222263F9-B85X-BT3 | NEC | Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77 |
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MC-222264F9-B85X-BT3 | NEC | Memory Circuit, 2MX16, CMOS, PBGA77, 12 X 7 MM, FBGA-77 |
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MC-222272F9-B85X-BT3 | RENESAS | IC,MIXED MEMORY,FLASH+SRAM,HYBRID,BGA,77PIN,PLASTIC |
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