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MBRM120ET1G PDF预览

MBRM120ET1G

更新时间: 2024-01-17 09:14:28
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 70K
描述
Surface Mount Schottky Power Rectifier

MBRM120ET1G 数据手册

 浏览型号MBRM120ET1G的Datasheet PDF文件第2页浏览型号MBRM120ET1G的Datasheet PDF文件第3页浏览型号MBRM120ET1G的Datasheet PDF文件第4页浏览型号MBRM120ET1G的Datasheet PDF文件第5页浏览型号MBRM120ET1G的Datasheet PDF文件第6页 
MBRM120E  
Surface Mount  
Schottky Power Rectifier  
POWERMITE®  
Power Surface Mount Package  
http://onsemi.com  
The Schottky Powermite employs the Schottky Barrier principle  
with a barrier metal and epitaxial construction that produces optimal  
forward voltage drop−reverse current tradeoff. The advanced  
packaging techniques provide for a highly efficient micro miniature,  
space saving surface mount Rectifier. With its unique heatsink design,  
the Powermite has the same thermal performance as the SMA while  
being 50% smaller in footprint area, and delivering one of the lowest  
height profiles, < 1.1 mm in the industry. Because of its small size, it is  
ideal for use in portable and battery powered products such as cellular  
and cordless phones, chargers, notebook computers, printers, PDAs  
and PCMCIA cards. Typical applications are AC−DC and DC−DC  
converters, reverse battery protection, and “Oring” of multiple supply  
voltages and any other application where performance and size are  
critical.  
SCHOTTKY BARRIER  
RECTIFIER  
1.0 AMPERES, 20 VOLTS  
ANODE  
CATHODE  
POWERMITE  
CASE 457  
PLASTIC  
Features  
Low Profile − Maximum Height of 1.1 mm  
Small Footprint − Footprint Area of 8.45 mm2  
MARKING DIAGRAM  
Low V Provides Higher Efficiency and Extends Battery Life  
F
M
BCVG  
Supplied in 12 mm Tape and Reel  
Low Thermal Resistance with Direct Thermal Path of Die on  
Exposed Cathode Heat Sink  
Pb−Free Packages are Available  
BCV  
M
G
= Device Code  
= Date Code  
= Pb−Free Package  
Mechanical Characteristics  
Powermite is JEDEC Registered as DO−216AA  
Case: Molded Epoxy  
Epoxy Meets UL 94 V−0 @ 0.125 in  
Weight: 16.3 mg (approximately)  
Lead and Mounting Surface Temperature for Soldering Purposes  
260°C Maximum for 10 Seconds  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
September, 2006 − Rev. 2  
MBRM120E/D  

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