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MBRB20200CT-BP PDF预览

MBRB20200CT-BP

更新时间: 2024-11-19 13:11:11
品牌 Logo 应用领域
美微科 - MCC 高压
页数 文件大小 规格书
3页 211K
描述
Rectifier Diode, Schottky, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, D2PAK-3

MBRB20200CT-BP 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:TO-263
包装说明:D2PAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.14
Is Samacsys:N其他特性:LOW LEAKAGE CURRENT
应用:HIGH VOLTAGE POWER外壳连接:CATHODE
配置:COMMON CATHODE, 2 ELEMENTS二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):0.8 V
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1最大非重复峰值正向电流:150 A
元件数量:2相数:1
端子数量:2最高工作温度:150 °C
最大输出电流:10 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大重复峰值反向电压:200 V子类别:Rectifier Diodes
表面贴装:YES技术:SCHOTTKY
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:10
Base Number Matches:1

MBRB20200CT-BP 数据手册

 浏览型号MBRB20200CT-BP的Datasheet PDF文件第2页浏览型号MBRB20200CT-BP的Datasheet PDF文件第3页 
M C C  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
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MBRB20200CT  
Micro Commercial Components  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
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20 Amp High Voltage  
Power Schottky  
Barrier Rectifier  
200Volts  
Features  
High Junction Temperature Capability  
·
Epoxy meets UL 94 V-0 flammability rating  
·
Moisture Sensitivity Level 1  
Low Leakage Current  
x
Marking : type number  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
D2-PACK  
S
Maximum Ratings  
V
A
·
·
Operating Temperature: -55°C to +150°C  
Storage Temperature: -55°C to +175°C  
1
2
3
G
MCC  
Catalog  
Number  
Maximum  
Recurrent  
Peak Reverse  
Voltage  
Maximum Maximum  
DC  
B
4
RMS  
Voltage  
Blocking  
Voltage  
200V  
D
MBRB 20200 CT  
200 V  
140V  
C
H
E
J
K
Electrical Characteristics @ 25°C Unless Otherwise Specified  
1
3
2 , 4  
HEATSINK  
Average Forward  
Current  
IF(AV)  
20 A  
TC = 125 °C  
Peak Forward Surge  
Current  
Maximum  
Instantaneous  
Forward Voltage  
MBRB20200CT  
IFSM  
150A  
8.3ms,half  
sine wave  
DIMENSIONS  
INCHES  
MM  
DIM  
NOTE  
MIN  
.320  
.380  
.160  
.020  
.045  
.095  
.096  
.014  
.090  
.575  
.045  
MAX  
MIN  
8.13  
9.65  
4.06  
0.51  
1.14  
2.41  
2.43  
0.35  
2.29  
14.60  
1.14  
MAX  
9.65  
10.45  
4.83  
0.89  
1.50  
2.67  
3.03  
0.53  
2.79  
15.80  
1.40  
A
B
C
D
E
G
H
J
.380  
.411  
.190  
.035  
.059  
.105  
.120  
.021  
.110  
.625  
.055  
IFM = 10A  
VF  
.95 V  
.80V  
TJ = 25°C  
IFM = 10A  
V
F
K
S
V
TJ = 125°C  
SUGGESTED SOLDER PAD LAYOUT  
.740  
18.79  
.065  
1.65  
Maximum  
IR  
Inches  
mm  
50uA  
T = 25°C  
T = 125°C  
c
c
Reverse Current At  
Rated DC Blocking  
Voltage  
.420  
10.66  
15mA  
.070  
1.78  
.120  
3.05  
.330  
8.38  
*Pulse Test: Pulse Width380µsec, Duty Cycle 2%  
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.  
www.mccsemi.com  
1 of 3  
Revision: A  
2011/01/01  

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