生命周期: | Active | 包装说明: | FBGA, BGA337,25X25,20 |
Reach Compliance Code: | compliant | 风险等级: | 5.8 |
JESD-30 代码: | S-PBGA-B337 | 端子数量: | 337 |
最高工作温度: | 85 °C | 最低工作温度: | -20 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA337,25X25,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 1.8,3.3 V |
认证状态: | Not Qualified | 子类别: | Telecom Encryption Circuits |
最大压摆率: | 450 mA | 表面贴装: | YES |
技术: | CMOS | 电信集成电路类型: | DATA ENCRYPTION CIRCUIT |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
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