是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | SOP, SOP16,.3 |
针数: | 16 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.32 | Is Samacsys: | N |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e0 |
长度: | 10.15 mm | 信道数量: | 3 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 70 °C | 最低工作温度: | -30 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP16,.3 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 2.25 mm | 子类别: | Power Management Circuits |
最大供电电压 (Vsup): | 5.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | OTHER | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5.3 mm | Base Number Matches: | 1 |
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