Datasheet > MB290_15

MB290_15

更新时间： 2024-09-22 01:19:03

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描述
Generation II LEDs

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MB290_15 数据手册

MegaBright Generation II LEDs

CxxxMB290-Sxx00

Cree’s MB™ Generation II series of MegaBright LEDs combine highly efﬁcient InGaN materials with Cree’s

proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a

geometrically enhanced vertical chip structure to maximize light extraction efﬁciency and require only a single wire

bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant ﬂux bins. Cree’s

MB series chips are tested for conformity to optical and electrical speciﬁcations and the ability to withstand 1000V

ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive

lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series

chips are compatible with most radial and SMT LED assembly processes.

FEATURES

APPLICATIONS

•

MegaBright LED Performance

•

White LEDs

–

460 & 470nm

LCD Backlighting Units

Outdoor LED Video Displays

Automotive Dashboard Lighting

Trafﬁc Signals



MB-8 – 8.0 mW min.

MB-10 - 10.0 mW min.

MB-12 - 12.0 mW min.

MB-14 - 14.0 mW min.

MB-16 - 16.0 mW min (460 nm)

–

505 nm - 6.0 mW min.

527 nm - 5.0 mW min.

•

Single Wire Bond Structure

Class 2 ESD Rating

CxxxMB290-Sxx00 Chip Diagram

Top View

Bottom View

Die Cross Section

G•SiC LED Chip

InGaN

300 x 300 μm

Anode (+)

Mesa (junction)

250 x 250 μm

SiC Substrate

h = 250 μm

Gold Bond Pad

112 μm Diameter

Backside

Metallization

Cathode (-)

Subject to change without notice.

www.cree.com

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