MB1S-MB10S
星合 子
XINGHE ELECTRONICS
VOLTAGE RANGE: 50 --- 1000 V
CURRENT: 0.5 A
FEATURES
This series is UL recognized under Component Index,
file number E239431
Glass passivated chip junctions
Plastic materrial has U/L flammabilityclassification
94V-O
MBS
4.6±0.2
High surge overload rating: 35A peak
Saves space on printed circuit boards
High temperature soldering guaranteed:
260°C/10 seconds at 5 lbs. (2.3kg) tension
MECHANICAL DATA
3.8±0.2
Case: Molded plastic bodyover passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
0.6±0.1
2.5±0.25
1.0±0.15
6.8±0.2
0.3±0.1
Polarity: Polaritysymbols marked on body
Dimensions in inches and (millimeters)
Mounting Position: Any
Dimensions in millimeters
Weight: 0.0078 ounce, 0.22 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate by20%.
MB05S MB1S MB2S MB4S MB6S MB8S MB10S
UNITS
50
35
50
100
70
200
140
200
400
280
600
420
600
800
560
800
1000
700
V
V
V
Maximum recurrent peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
100
400
1000
Maximum DC blocking voltage
Maximum average forw ard
1)
0.5
A
IF(AV)
2)
0.8
output current
@TA=25
Peak forw ard surge current
8.3ms single half-sine-w ave
superimposed on rated load
IFSM
A
V
35.0
Maximum instantaneous forw ard voltage
@ 0.4 A
VF
1.0
A
Maximum reverse current
@TA=25
5.0
0.5
13
μ
IR
mA
pF
at rated DC blocking voltage @TA=100
Typical junction capacitance per leg (NOTE 3)
CJ
Typical thermal resistance per leg (NOTE 1)
R θJA
RθJL
85
20
/W
(NOTE 2)
Operating junction temperature range
Storage temperature range
- 55 ---- + 150
TJ
TSTG
- 55 ---- + 150
NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
(3) Measured at 1.0 MHz and applied reverse v oltage of 4.0 Volts
1
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