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MB1-130-01-F-S-01-SL PDF预览

MB1-130-01-F-S-01-SL

更新时间: 2024-11-25 14:43:23
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 538K
描述
Card Edge Connector, 30 Contact(s), 1 Row(s), Female, Right Angle, Surface Mount Terminal, Socket, ROHS COMPLIANT

MB1-130-01-F-S-01-SL 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.69.40.40风险等级:5.73
其他特性:MICRO CARD主体/外壳类型:SOCKET
连接器类型:CARD EDGE CONNECTOR联系完成配合:GOLD FLASH OVER NICKEL (50)
联系完成终止:Matte Tin (Sn) - with Nickel (Ni) barrier触点性别:FEMALE
触点材料:BERYLLIUM COPPER/BRASSDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
JESD-609代码:e3MIL 符合性:NO
混合触点:NO安装方式:RIGHT ANGLE
安装类型:BOARD装载的行数:1
选件:GENERAL PURPOSE端子节距:1 mm
端接类型:SURFACE MOUNT触点总数:30
Base Number Matches:1

MB1-130-01-F-S-01-SL 数据手册

  
F-219 SUPPLEMENT  
MB1–130–01–F–S–01–SL–N  
MB1–130–01–F–S–01–SL  
(1.00 mm) .0394"  
MB1 SERIES  
MINI EDGE CARD SOCKET WITH GUIDES  
Choice of two  
card thicknesses  
Mates with:  
(0.80 mm) .031" PCB,  
(1.60 mm) .062" PCB  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?MB1  
Insulator Material:  
Black LCP  
Contact Material:  
BeCu  
Plating:  
Sn or Au over  
50 µ" (1.27 µm) Ni  
Current Rating:  
2.2 A per pin  
(6 pins powered)  
Operating Temp Range:  
-55 °C to +125 °C  
Insertion Depth:  
(5.26 mm) .207" to  
(6.10 mm) .240"  
RoHS Compliant:  
Yes  
(5.44 mm)  
.214"  
(1.00 mm)  
.03937" pitch  
PROCESSING  
Lead–Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0.10 mm) .004" max (20-30)  
(0.15 mm) .006" max (40-50)*  
*(.004" stencil solution  
may be available; contact  
IPG@samtec.com)  
PLATING  
OPTION  
CARD  
SLOT  
OTHER  
OPTION  
NO. OF  
PINS  
1
MB1  
01  
S
SL  
RECOGNITIONS  
Specify  
CARD  
SLOT  
from  
–N  
= No Card  
Guides  
For complete scope  
of recognitions see  
www.samtec.com/quality  
–F  
20, 30, 40, 50  
= Gold flash on contact,  
Matte Tin on tail  
(No. of Positions + 2)  
x (1.00) .03937 + (4.06) .160  
chart  
FILE NO. E111594  
–L  
(3.81)  
.150  
= 10 µ" (0.25 µm)  
Gold on contact,  
Matte Tin on tail  
CARD  
SLOT  
MATES WITH  
BOARD THICKNESS  
A
ALSO AVAILABLE  
(0.97)  
.038  
(0.80)  
.031  
–01  
(MOQ Required)  
(1.83)  
.072  
(1.60)  
.062  
–02  
• Other platings  
(25.5)  
1.004  
(7.24)  
.285  
(7.24)  
.285  
–N OPTION  
01  
(1.00)  
.03937  
50  
(0.36)  
(1.27)  
.050  
.014  
(1.27)  
.050  
(No. of Positions + 2)  
x (1.00) .03937  
A
(1.52)  
.060  
(0.15)  
.006  
(5.44)  
.214  
(0.69)  
.027  
(1.27)  
.050  
DIA  
(2.36)  
.093  
Notes:  
Patented  
Some sizes, styles and  
options are non-standard,  
non-returnable.  
Important Note: Samtec recommends that pads on the mating board be Gold plated.  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
WWW.SAMTEC.COM  
All parts within this catalog are built to Samtec’s specifications.  
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.  

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