Datasheet > 消费电路 > 音频控制集成电路> MAX9796EBX+T

MAX9796EBX+T

更新时间： 2024-01-17 18:58:03

品牌	Logo	应用领域
美信 - MAXIM		音频控制集成电路消费电路商用集成电路放大器信息通信管理
页数	文件大小	规格书
27页	359K
描述
2.3W, High-Power Class D Audio Subsystem with DirectDrive Headphone Amplifiers

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

MAX9796EBX+T 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	VFBGA, BGA36,6X6,20	针数：	36
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.75
Is Samacsys：	N	信道分离：	75 dB
商用集成电路类型：	VOLUME CONTROL CIRCUIT	JESD-30 代码：	S-PBGA-B36
JESD-609代码：	e3	长度：	3.06 mm
湿度敏感等级：	1	信道数量：	2
功能数量：	1	端子数量：	36
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	VFBGA
封装等效代码：	BGA36,6X6,20	封装形状：	SQUARE
封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	260
电源：	3.3 V	认证状态：	Not Qualified
座面最大高度：	0.67 mm	子类别：	Audio/Video Amplifiers
最大压摆率：	21 mA	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2.7 V	表面贴装：	YES
技术：	BICMOS	温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)	端子形式：	BALL
端子节距：	0.5 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	3.06 mm
Base Number Matches：	1

MAX9796EBX+T 数据手册

2.3W, High-Power Class D Audio Subsystem

with DirectDrive Headphone Amplifiers

Charge-Pump Capacitor Selection

Use capacitors with an ESR less than 100mΩ for opti-

mum performance. Low-ESR ceramic capacitors mini-

mize the output resistance of the charge pump. Most

surface-mount ceramic capacitors satisfy the ESR

requirement. For best performance over the extended

temperature range, select capacitors with an X7R dielec-

tric or better. Table 12 lists suggested manufacturers.

parasitic trace resistance. Large traces also aid in mov-

ing heat away from the package. Proper grounding

improves audio performance, minimizes crosstalk

between channels, and prevents any switching noise

from coupling into the audio signal. Connect PGND and

GND together at a single point on the PCB. Route all

traces that carry switching transients away from GND

and the traces/components in the audio signal path.

Connect all of the power-supply inputs (CPV , V

MAX796

Flying Capacitor (C1)

The value of the flying capacitor (C1) affects the output

resistance of the charge pump. A C1 value that is too

small degrades the device’s ability to provide sufficient

current drive, which leads to a loss of output voltage.

Increasing the value of C1 reduces the charge-pump out-

put resistance to an extent. Above 1µF, the on-resistance

of the switches and the ESR of C1 and C2 dominate.

and PV ) together. Bypass CPV

with a 1µF capaci-

tor to CPGND. Bypass V

GND. Bypass PV

with a 1µF capacitor to

with a 1µF capacitor in parallel with

a 0.1µF capacitor to PGND. Place the bypass capaci-

tors as close as possible to the MAX9796. Place a bulk

capacitor between PV

and PGND, if needed.

Use large, low-resistance output traces. Current drawn

from the outputs increase as load impedance decreas-

es. High output trace resistance decreases the power

delivered to the load. Large output, supply, and GND

traces allow more heat to move from the MAX9796 to the

PCB, decreasing the thermal impedance of the circuit.

Output Capacitor (C2)

The output capacitor value and ESR directly affect the

ripple at CPV . Increasing the value of C2 reduces

output ripple. Likewise, decreasing the ESR of C2

reduces both ripple and output resistance. Lower

capacitance values can be used in systems with low

maximum output power levels. See the Output Power

vs. Load Resistance and Charge-Pump Capacitor Size

graph in the Typical Operating Characteristics.

UCSP Applications Information

For the latest application details on UCSP construction,

dimensions, tape carrier information, PCB techniques,

bump-pad layout, and recommended reflow tempera-

ture profile, as well as the latest information of reliability

testing results, refer to Application Note: UCSP—A

Wafer-Level Chip-Scale Package available on Maxim’s

website at www.maxim-ic.com/ucsp.

CPV

Bypass Capacitor (C3)

The CPV

bypass capacitor (C3) lowers the output

impedance of the power supply and reduces the

impact of the MAX9796’s charge-pump switching tran-

sients. Bypass CPV

physically close to the CPV

for C3 that is equal to C1.

with C3 to PGND and place it

UCSP Thermal Consideration

When operating at maximum output power, the UCSP

thermal dissipation can become a limiting factor. The

UCSP package does not dissipate heat as efficiently as

packages with a thermal pad. As a result, in some

applications, the thermal performance of the package

may limit performance.

and PGND. Use a value

Supply Bypassing, Layout, and Grounding

Proper layout and grounding are essential for optimum

performance. Use large traces for the power-supply

inputs and amplifier outputs to minimize losses due to

Table 12. Suggested Capacitor Manufacturers

SUPPLIER

Taiyo Yuden

TDK

PHONE

FAX

WEBSITE

www.t-yuden.com

www.component.tdk.com

800-348-2496

847-803-6100

847-925-0899

847-390-4405

Chip Information

PROCESS: BiCMOS

26 ______________________________________________________________________________________

1...23 24 252627

下载PDF

与MAX9796EBX+T相关器件

型号	品牌	描述	获取价格	数据表
MAX9796EBX+TG45	MAXIM	Volume Control Circuit	获取价格
MAX98050	ADI	低功耗、高性能音频编解码器	获取价格
MAX98088	MAXIM	Stereo Audio Codec with FLEXSOUND Technology	获取价格
MAX98088_V01	MAXIM	Stereo Audio Codec with FlexSound Technology	获取价格
MAX98088EWY+	MAXIM	Stereo Audio Codec with FLEXSOUND Technology	获取价格
MAX98089	MAXIM	Low-Power, Stereo Audio Codec with FlexSound Technology	获取价格

与MAX9796EBX+T相关文章

SG3525资料手册详解：SG3525参数分析、引脚说明、应用介绍
2024-05-23

5
AT89C51单片机资料手册详细解析及应用示例
2024-05-23

8
CP2102资料手册解读：CP2102引脚说明、关键参数分析
2024-05-23

4
资料手册解读：UC3842参数和管脚说明
2024-05-22

6

产品中心

服务支持

精选活动

关于我们

帮助中心

MAX9796EBX+T

MAX9796EBX+T 技术参数

MAX9796EBX+T 数据手册

与MAX9796EBX+T相关器件

与MAX9796EBX+T相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MAX9796EBX+T

MAX9796EBX+T 技术参数

MAX9796EBX+T 数据手册

与MAX9796EBX+T相关器件

与MAX9796EBX+T相关文章

您还可以找

您在本页遇到什么问题？