是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | HVQCCN, LCC40,.2SQ,16 | 针数: | 40 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 1.36 |
Is Samacsys: | N | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-XQCC-N40 |
JESD-609代码: | e3 | 长度: | 5 mm |
湿度敏感等级: | 1 | 信道数量: | 4 |
功能数量: | 1 | 端子数量: | 40 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装等效代码: | LCC40,.2SQ,16 | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 3.6 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Power Management Circuits |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 2.6 V |
标称供电电压 (Vsup): | 3.6 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | NO LEAD |
端子节距: | 0.4 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 5 mm |
Base Number Matches: | 1 |
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