是否无铅: | 不含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, PLASTIC, DIP-8 | 针数: | 8 |
Reach Compliance Code: | unknown | 风险等级: | 5.15 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PDIP-T8 | JESD-609代码: | e0 |
长度: | 9.375 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 峰值回流温度(摄氏度): | 245 |
座面最大高度: | 4.572 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.1 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
Base Number Matches: | 1 |
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