是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | TFQFP, TQFP80,.55SQ | 针数: | 80 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.48 | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | S-PQFP-G80 |
JESD-609代码: | e3 | 长度: | 12 mm |
湿度敏感等级: | 3 | 信道数量: | 4 |
功能数量: | 1 | 端子数量: | 80 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFQFP |
封装等效代码: | TQFP80,.55SQ | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3,12 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 2.5 mA | 最大供电电压 (Vsup): | 13.2 V |
最小供电电压 (Vsup): | 10.8 V | 标称供电电压 (Vsup): | 12 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 12 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX5960L | MAXIM |
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MAX5960LECS+ | MAXIM |
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MAX5960LEVCMAXQU | MAXIM |
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Demonstrates PCI Express x16 Quad Hot-Plug Design | |
MAX5960LEVCMAXQU+ | MAXIM |
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Demonstrates PCI Express x16 Quad Hot-Plug Design | |
MAX5960LEVKIT+ | MAXIM |
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Demonstrates PCI Express x16 Quad Hot-Plug Design | |
MAX5961 | MAXIM |
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0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor | |
MAX5961_09 | MAXIM |
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0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor | |
MAX5961ETM+ | MAXIM |
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Power Supply Support Circuit, Adjustable, 4 Channel, BICMOS, 7 X 7 MM, ROHS COMPLIANT, MO- | |
MAX5963 | MAXIM |
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Dual, 7.5V to 76V, Hot-Swap and Diode ORing Controller | |
MAX5963UTL+ | MAXIM |
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Dual, 7.5V to 76V, Hot-Swap and Diode ORing Controller |