是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 48 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.33 | Is Samacsys: | N |
JESD-30 代码: | S-XQCC-N48 | JESD-609代码: | e0 |
长度: | 7 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 48 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 标称供电电压: | 3 V |
表面贴装: | YES | 技术: | CMOS |
电信集成电路类型: | RF AND BASEBAND CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX5863E/D | MAXIM |
获取价格 |
Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End |
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MAX5863ETM | MAXIM |
获取价格 |
Ultra-Low-Power, High-Dynamic Performance, 7.5Msps Analog Front End |
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MAX5863ETM+ | MAXIM |
获取价格 |
RF and Baseband Circuit, CMOS, 7 X 7 MM, 0.80 MM HEIGHT, TQFN-48 |
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MAX5863ETM+T | MAXIM |
获取价格 |
暂无描述 |
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MAX5863ETM-T | MAXIM |
获取价格 |
RF and Baseband Circuit, CMOS, 7 X 7 MM, 0.80 MM HEIGHT, TQFN-48 |
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MAX5864 | MAXIM |
获取价格 |
Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End |
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MAX5864 | ADI |
获取价格 |
超低功耗、高动态性能、22Msps模拟前端 |
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MAX5864E/D | MAXIM |
获取价格 |
Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End |
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MAX5864ETM | MAXIM |
获取价格 |
Ultra-Low-Power, High-Dynamic- Performance, 22Msps Analog Front End |
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MAX5864ETM | ROCHESTER |
获取价格 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, TQFN-48 |
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