是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, QFN-8 | 针数: | 8 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.04 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XDSO-N8 | JESD-609代码: | e0 |
长度: | 3 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVSON |
封装等效代码: | SOLCC8,.12,25 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 240 |
电源: | 2.7/24 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Other Analog ICs |
最大供电电流 (Isup): | 0.25 mA | 最大供电电压 (Vsup): | 24 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 12 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Tin/Lead (Sn85Pb15) |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 3 mm | Base Number Matches: | 1 |
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