是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | , BGA108,9X12,16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 12 weeks |
风险等级: | 5.75 | 位大小: | 32 |
CPU系列: | CORTEX-M3 | 端子数量: | 108 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装等效代码: | BGA108,9X12,16 |
电源: | 2/3.3 V | 认证状态: | Not Qualified |
RAM(字节): | 32768 | ROM(单词): | 262144 |
ROM可编程性: | FLASH | 速度: | 24 MHz |
子类别: | Microcontrollers | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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MAX3260C/D | MAXIM |
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1GHz Transimpedance Preamplifier with 25dB Dynamic Range | |
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Interface Circuit, PQFP32, TQFP-32 | |
MAX3261CCJ-T | MAXIM |
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Interface Circuit, BIPolar, PQFP32, TQFP-32 | |
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Single +5V, Fully Integrated, 1.25Gbps Laser Diode Driver | |
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Single +5V, Fully Integrated, 1.25Gbps Laser Diode Driver | |
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Interface Circuit, PQFP32, TQFP-32 |