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MAX3023EBC-T PDF预览

MAX3023EBC-T

更新时间: 2024-11-30 12:58:35
品牌 Logo 应用领域
美信 - MAXIM 转换器电平转换器
页数 文件大小 规格书
21页 850K
描述
Interface Circuit, BICMOS, PBGA12, UCSP-12

MAX3023EBC-T 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:UCSP-12针数:12
Reach Compliance Code:not_compliant风险等级:5.68
Is Samacsys:N接口集成电路类型:INTERFACE CIRCUIT
JESD-30 代码:R-PBGA-B12JESD-609代码:e0
长度:2.02 mm湿度敏感等级:1
功能数量:4端子数量:12
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装等效代码:BGA12,3X4,20封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):240
电源:1.8/3.3 V认证状态:Not Qualified
座面最大高度:0.67 mm子类别:Other Interface ICs
最大供电电压:3.6 V最小供电电压:1.65 V
标称供电电压:2.5 V电源电压1-最大:3.2 V
电源电压1-分钟:1.2 V电源电压1-Nom:1.8 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:1.54 mmBase Number Matches:1

MAX3023EBC-T 数据手册

 浏览型号MAX3023EBC-T的Datasheet PDF文件第2页浏览型号MAX3023EBC-T的Datasheet PDF文件第3页浏览型号MAX3023EBC-T的Datasheet PDF文件第4页浏览型号MAX3023EBC-T的Datasheet PDF文件第5页浏览型号MAX3023EBC-T的Datasheet PDF文件第6页浏览型号MAX3023EBC-T的Datasheet PDF文件第7页 
19-3266; Rev 1; 8/04  
+1.2V to +3.6V, 0.1µA, 100Mbps,  
Single-/Dual-/Quad-Level Translators  
General Description  
Features  
100Mbps Guaranteed Data Rate  
The MAX13013–MAX13017/MAX3023–MAX3028 single-/  
dual-/quad-level translators provide the level shifting  
necessary to allow 100Mbps data transfer in a multivolt-  
Bidirectional Level Translation  
MAX13013 (Single)  
MAX13014 (Dual)  
MAX3023 (Quad)  
age system. Externally applied voltages, V  
and V , set  
L
CC  
the logic levels on either side of the device. Logic signals  
present on the V side of the device appear as a higher  
Unidirectional Level Translation  
L
MAX13015/MAX13016/MAX13017 (Dual)  
MAX3024–MAX3028 (Quad)  
voltage logic signal on the V  
side of the device, and  
CC  
vice-versa.  
V Operation Down to +1.2V  
L
The MAX13013 single-, the MAX13014–MAX13017  
dual-, and the MAX3023–MAX3028 (UCSP™ package)  
quad-level translators feature an enable (EN) input. The  
MAX3023–MAX3028 (TSSOP package) quad-level  
translators feature EN and EN inputs. When disabled,  
each device places all inputs/outputs on both sides in  
Ultra-Low 0.1µA Supply Current When Disabled  
Low-Quiescent Current (0.1µA)  
UCSP, SC70, SOT23, and TSSOP Packages  
Pin Configurations  
tri-state and reduces the V  
supply current to 0.03µA,  
CC  
and the V supply current to 0.1µA. These devices oper-  
TOP VIEW  
L
1
2
3
ate at a guaranteed 100Mbps data rate for V > 1.8V.  
L
A
V
1
2
3
6
5
4
EN  
CC  
The MAX13013–MAX13017/MAX3023–MAX3028 accept  
V
CC  
I/O V  
1
GND  
CC  
a +1.65V to +3.6V V  
voltage and a +1.2V to (V  
-
CC  
CC  
MAX13013  
0.4V) V voltage, making them ideal for data transfer  
L
GND  
V
L
MAX13013  
between low-voltage ASICs/programmable logic  
devices (PLDs) and higher voltage systems. The  
MAX13013 is available in 3 x 2 UCSP and 6-pin SC70  
packages. The MAX13014–MAX13017 are available in  
3 x 3 UCSP and 8-pin SOT23 packages. The  
MAX3023–MAX3028 are available in 4 x 3 UCSP and  
14-pin TSSOP packages. All devices operate over the  
extended -40°C to +85°C temperature range.  
B
V
L
I/O V 1  
L
EN  
I/O V  
1
I/O V 1  
L
CC  
3 x 2 UCSP  
TOP VIEW  
(BUMPS ON BOTTOM OF DIE)  
SC70  
Typical Operating Circuit  
+1.8V  
+3.3V  
Applications  
0.1µF  
0.1µF  
CMOS Logic-Level Translation  
Low-Voltage ASIC Level Translation  
Cell Phones  
V
L
V
CC  
+1.8V  
SYSTEM  
CONTROLLER  
+3.3V  
SYSTEM  
MAX13014  
SPI™, MICROWIRE™ Level Translation  
Portable POS Systems  
CLK  
DATA  
I/O V 1  
I/O V  
1
CLK  
DATA  
L
CC  
I/O V 2  
I/O V 2  
CC  
L
GND  
GND  
GND  
Portable Communication Devices  
GPS  
Telecommunications Equipment  
Ordering Information/Selector Guide  
NUMBER OF  
V  
TRANSLATORS TRANSLATORS  
Number of  
V  
PACKAGE  
CODE  
TOP  
MARK  
V
L
V
CC  
PART  
TEMP RANGE  
PIN-PACKAGE  
EN EN  
CC  
L
MAX13013EXT  
-40°C to +85°C  
6 SC70  
ACD  
1
1
Pin Configurations continued at end of data sheet.  
Ordering Information/Selector Guide continued at end of  
data sheet.  
MICROWIRE is a trademark of National Semiconductor Corp.  
SPI is a trademark of Motorola, Inc.  
UCSP is a trademark of Maxim Integrated Products, Inc.  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  

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