MAX2680/MAX2681/
MAX2682
400MHz to 2.5GHz, Low-Noise,
SiGe Downconverter Mixers
Power-Supply Layout
Table 3. IFOUT Port Impedance
To minimize coupling between different sections of the IC,
the ideal power-supply layout is a star configuration with
FREQUENCY
PART
45MHz
960-j372
934-j373
670-j216
70MHz
803-j785
746-j526
578-j299
240MHz
186-j397
161-j375
175-j296
a large decoupling capacitor at a central V
node. The
CC
MAX2680
MAX2681
MAX2682
V
traces branch out from this central node, each going
CC
to a separate V
node on the PC board. At the end of
CC
each trace is a bypass capacitor that has low ESR at the
RF frequency of operation. This arrangement provides
local decoupling at the V
pin. At high frequencies, any
CC
signal leaking out of one supply pin sees a relatively high
impedance (formed by the V trace inductance) to the
Table 4. IF Output Impedance-Matching
Components
CC
central V
node, and an even higher impedance to any
CC
other supply pin, as well as a low impedance to ground
through the bypass capacitor.
FREQUENCY
70MHz
330nH
MATCHING
COMPONENT
45MHz
390nH
39pF
240MHz
82nH
3pF
Impedance-Matching Network Layout
L1
C2
R1
The RFIN and IFOUT impedance-matching networks
are very sensitive to layout-related parasitics. To mini-
mize parasitic inductance, keep all traces short and
place components as close as possible to the chip. To
minimize parasitic capacitance, use cutouts in the ground
plane (and any other plane) below the matching network
components. However, avoid cutouts that are larger than
necessary since they act as aperture antennas.
15pF
250Ω
Open
Open
Typical Operating Circuit
C1
LO
1
2
6
5
4
SHUTDOWN
CONTROL
C3
SHDN
LO
INPUT
MAX2680
MAX2681
MAX2682
V
CC
V
CC
GND
+2.7V TO +5.5V
C4
C5
10µF
1000pF
R1
L1
Z
Z
2
1
RF
IF
OUTPUT
3
RFIN
IFOUT
INPUT
C2
Z
3
THE VALUES OF MATCHING COMPONENTS C2, L1, R1, Z1, Z2, AND Z3 DEPEND ON THE IF AND RF FREQUENCY AND DOWNCONVERTER. SEE TABLES 2 AND 4.
Maxim Integrated
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