Datasheet > MAX2240

MAX2240

更新时间： 2024-10-02 22:35:27

品牌	Logo	应用领域
美信 - MAXIM		放大器功率放大器
页数	文件大小	规格书
10页	163K
描述
2.5GHz, +20dBm Power Amplifier IC in UCSP Package

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MAX2240 数据手册

19-1624; Rev 0; 3/00

2.5GHz, +20dBm Power Amplifier IC

in UCSP Package

General Description

Features

The MAX2240 single-supply, low-voltage power amplifi-

er (PA) IC is designed specifically for applications in

the 2.4GHz to 2.5GHz frequency band. The PA is com-

pliant with Bluetooth, HomeRF, and 802.11 standards,

as well as other FSK modulation systems. The PA pro-

vides a nominal +20dBm (100mW) output power in the

highest power mode.

ꢀ 2.4GHz to 2.5GHz Frequency Range

ꢀ High +20dBm Output Power

ꢀ 2-Bit Digital Power Control: 4 Output Levels

ꢀ Integrated Input Match to 50Ω

ꢀ Low 105mA Operating Current

ꢀ 0.5µA Low-Power Shutdown Mode Current

ꢀ +2.7V to +5V Single-Supply Operation

The PA includes a digital power control circuit to greatly

simplify control of the output power. Four digitally con-

trolled output power levels are provided: from +3dBm

to +20dBm. A digital input controls the active or shut-

down operating modes of the PA. In the shutdown

mode, the current reduces to 0.5µA.

ꢀ Ultra-Chipscale Package

(1.56mm x 1.56mm)

The IC integrates the RF input and interstage matching

to simplify application of the IC. Temperature and sup-

ply-independent biasing are also included to provide

stable performance under all operating conditions.

The IC operates from a +2.7V to +5V single-supply volt-

age. No negative bias voltage is required. Current con-

sumption is a modest 105mA at the highest power

level.

Ordering Information

PART

TEMP. RANGE

PIN-PACKAGE

MAX2240EBL

-40°C to +85°C

9 UCSP*

*UCSP reliability is integrally linked to the user’s assembly

methods, circuit board material, and environment. Refer to the

UCSP Reliability Notice in the UCSP Reliability section of this

data sheet for more information.

The part is packaged in the ultra-chipscale package

(UCSP), significantly reducing the required PC board

area. The chip occupies only a 1.56mm x 1.56mm area.

The 3 x 3 array of solder bumps are spaced with a

0.5mm bump pitch.

Pin Configuration appears at end of data sheet.

________________________Applications

Bluetooth

HomeRF

802.11 FHSS WLAN

2.4GHz ISM Proprietary Radios

Typical Application Circuit/Functional Diagram

18pF

220 pF

1.2nH* (BOARD TRACE)

BIAS

22nH

BIAS &

POWER

CONTROL

75Ω

θ = 26°

SHDN

RFOUT

RFIN

MATCH

RFOUT

10pF

GND1

GND2

65Ω

θ = 41°

*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE

(SEE APPLICATIONS SECTION).

________________________________________________________________ Maxim Integrated Products

For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.

For small orders, phone 1-800-835-8769.

12 3 4 5 6 7...10

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与MAX2240相关器件

型号	品牌	获取价格	描述	数据表
MAX2240_1	MAXIM	获取价格	Evaluation Kit
MAX2240EBL	MAXIM	获取价格	2.5GHz, +20dBm Power Amplifier IC in UCSP Package
MAX2240EBL	ROCHESTER	获取价格	2400MHz - 2500MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, UCSP-9
MAX2240EBL+	MAXIM	获取价格	Telecom Circuit, 1-Func, PBGA9, 3 X 3 MM, 0.5 MM PITCH, UCSP-9
MAX2240EBL+T	MAXIM	获取价格	RF/Microwave Amplifier, 1 Func
MAX2240EBL-T	ROCHESTER	获取价格	2400MHz - 2500MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER, UCSP-9
MAX2240EPL	MAXIM	获取价格	Amplifier. Other
MAX2240EVKIT	MAXIM	获取价格	Evaluation Kit for the MAX2240
MAX2242	MAXIM	获取价格	2.4GHz to 2.5GHz Linear Power Amplifier
MAX22420	ADI	获取价格	Reinforced, Ultra-Low-Power, Two-Channel Digital Isolators

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