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MAX2240EBL+T PDF预览

MAX2240EBL+T

更新时间: 2024-10-03 21:06:07
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
10页 117K
描述
RF/Microwave Amplifier, 1 Func

MAX2240EBL+T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:BGA9,3X3,20Reach Compliance Code:compliant
风险等级:5.81安装特点:SURFACE MOUNT
功能数量:1端子数量:9
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装等效代码:BGA9,3X3,20
电源:3/5 V子类别:RF/Microwave Amplifiers
最大压摆率:155 mA表面贴装:YES
Base Number Matches:1

MAX2240EBL+T 数据手册

 浏览型号MAX2240EBL+T的Datasheet PDF文件第2页浏览型号MAX2240EBL+T的Datasheet PDF文件第3页浏览型号MAX2240EBL+T的Datasheet PDF文件第4页浏览型号MAX2240EBL+T的Datasheet PDF文件第5页浏览型号MAX2240EBL+T的Datasheet PDF文件第6页浏览型号MAX2240EBL+T的Datasheet PDF文件第7页 
19-1624; Rev 3; 8/11  
2.5GHz, +20dBm Power Amplifier IC  
in UCSP Package  
MAX240  
General Description  
Features  
The MAX2240 single-supply, low-voltage power amplifi-  
er (PA) IC is designed specifically for applications in  
the 2.4GHz to 2.5GHz frequency band. The PA is com-  
pliant with Bluetooth, HomeRF, and 802.11 standards,  
as well as other FSK modulation systems. The PA pro-  
vides a nominal +20dBm (100mW) output power in the  
highest power mode.  
o 2.4GHz to 2.5GHz Frequency Range  
o High +20dBm Output Power  
o 2-Bit Digital Power Control: Four Output Levels  
o Integrated Input Match to 50Ω  
o Low 105mA Operating Current  
o 0.5μA Low-Power Shutdown Mode Current  
o +2.7V to +5V Single-Supply Operation  
o Miniature Chip-Scale Package (1.56mm x 1.56mm)  
The PA includes a digital power control circuit to greatly  
simplify control of the output power. Four digitally con-  
trolled output power levels are provided: from +3dBm  
to +20dBm. A digital input controls the active or shut-  
down operating modes of the PA. In the shutdown  
mode, the current reduces to 0.5µA.  
The IC integrates the RF input and interstage matching  
to simplify application of the IC. Temperature and sup-  
ply-independent biasing are also included to provide  
stable performance under all operating conditions.  
The IC operates from a +2.7V to +5V single-supply volt-  
age. No negative bias voltage is required. Current con-  
sumption is a modest 105mA at the highest power  
level.  
Ordering Information  
PART  
MAX2240EBL+  
TEMP RANGE  
PIN-PACKAGE  
-40°C to +85°C  
9 UCSP*  
The part is packaged in the UCSP™ package signifi-  
cantly reducing the required PC board area. The chip  
occupies only a 1.56mm x 1.56mm area. The 3 x 3  
array of solder bumps are spaced with a 0.5mm bump  
pitch.  
*UCSP reliability is integrally linked to the user’s assembly  
methods, circuit board material, and environment. Refer to the  
UCSP Reliability Notice in the UCSP section of this data sheet  
for more information.  
+Denotes a lead(pB)-free/RoHS-compliant package.  
________________________Applications  
Bluetooth  
Bump Configuration appears at end of data sheet.  
HomeRF  
UCSP is a trademark of Maxim Integrated Products, Inc.  
802.11 FHSS WLAN  
2.4GHz ISM Proprietary Radios  
Typical Application Circuit/Functional Diagram  
V
V
CC  
V
CC  
CC  
18pF  
220 pF  
1.2nH* (BOARD TRACE)  
V
BIAS  
CC  
22nH  
D0  
D1  
BIAS &  
POWER  
CONTROL  
75Ω  
θ = 26°  
SHDN  
RFOUT  
RFIN  
MATCH  
RFOUT  
10pF  
GND1  
GND2  
65Ω  
θ = 41°  
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE  
(SEE APPLICATIONS SECTION).  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  

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