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MAX2240EBL

更新时间： 2024-10-02 22:35:27
品牌 Logo 应用领域
美信 - MAXIM 放大器功率放大器
页数 文件大小 规格书
10页 163K
描述
2.5GHz, +20dBm Power Amplifier IC in UCSP Package

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MAX2240EBL 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete包装说明：3 X 3 MM, 0.5 MM PITCH, UCSP-9
Reach Compliance Code：not_compliantHTS代码：8542.39.00.01
风险等级：5.83JESD-30 代码：S-PBGA-B9
JESD-609代码：e0功能数量：1
端子数量：9最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：VFBGA封装形状：SQUARE
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH座面最大高度：0.65 mm
标称供电电压：3.2 V表面贴装：YES
电信集成电路类型：TELECOM CIRCUIT温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM

MAX2240EBL 数据手册

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19-1624; Rev 0; 3/00  
2.5GHz, +20dBm Power Amplifier IC  
in UCSP Package  
General Description  
Features  
The MAX2240 single-supply, low-voltage power amplifi-  
er (PA) IC is designed specifically for applications in  
the 2.4GHz to 2.5GHz frequency band. The PA is com-  
pliant with Bluetooth, HomeRF, and 802.11 standards,  
as well as other FSK modulation systems. The PA pro-  
vides a nominal +20dBm (100mW) output power in the  
highest power mode.  
ꢀ 2.4GHz to 2.5GHz Frequency Range  
ꢀ High +20dBm Output Power  
ꢀ 2-Bit Digital Power Control: 4 Output Levels  
ꢀ Integrated Input Match to 50Ω  
ꢀ Low 105mA Operating Current  
ꢀ 0.5µA Low-Power Shutdown Mode Current  
ꢀ +2.7V to +5V Single-Supply Operation  
The PA includes a digital power control circuit to greatly  
simplify control of the output power. Four digitally con-  
trolled output power levels are provided: from +3dBm  
to +20dBm. A digital input controls the active or shut-  
down operating modes of the PA. In the shutdown  
mode, the current reduces to 0.5µA.  
ꢀ Ultra-Chipscale Package  
(1.56mm x 1.56mm)  
The IC integrates the RF input and interstage matching  
to simplify application of the IC. Temperature and sup-  
ply-independent biasing are also included to provide  
stable performance under all operating conditions.  
The IC operates from a +2.7V to +5V single-supply volt-  
age. No negative bias voltage is required. Current con-  
sumption is a modest 105mA at the highest power  
level.  
Ordering Information  
PART  
TEMP. RANGE  
PIN-PACKAGE  
MAX2240EBL  
-40°C to +85°C  
9 UCSP*  
*UCSP reliability is integrally linked to the user’s assembly  
methods, circuit board material, and environment. Refer to the  
UCSP Reliability Notice in the UCSP Reliability section of this  
data sheet for more information.  
The part is packaged in the ultra-chipscale package  
(UCSP), significantly reducing the required PC board  
area. The chip occupies only a 1.56mm x 1.56mm area.  
The 3 x 3 array of solder bumps are spaced with a  
0.5mm bump pitch.  
Pin Configuration appears at end of data sheet.  
________________________Applications  
Bluetooth  
HomeRF  
802.11 FHSS WLAN  
2.4GHz ISM Proprietary Radios  
Typical Application Circuit/Functional Diagram  
V
V
CC  
V
CC  
CC  
18pF  
220 pF  
1.2nH* (BOARD TRACE)  
V
CC  
BIAS  
22nH  
D0  
D1  
BIAS &  
POWER  
CONTROL  
75Ω  
θ = 26°  
SHDN  
RFOUT  
RFIN  
MATCH  
RFOUT  
10pF  
GND1  
GND2  
65Ω  
θ = 41°  
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE  
(SEE APPLICATIONS SECTION).  
________________________________________________________________ Maxim Integrated Products  
1
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.  
For small orders, phone 1-800-835-8769.  
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