是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 16 |
Reach Compliance Code: | not_compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.03 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XQCC-N16 | JESD-609代码: | e0 |
长度: | 4 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.6 V |
表面贴装: | YES | 温度等级: | OTHER |
端子面层: | Tin/Lead (Sn85Pb15) | 端子形式: | NO LEAD |
端子节距: | 0.65 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 4 mm |
Base Number Matches: | 1 |
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