是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | VFBGA, |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.71 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PBGA-B12 | 长度: | 2.035 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 12 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.69 mm |
最大供电电压 (Vsup): | 28 V | 最小供电电压 (Vsup): | 2.2 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.555 mm | Base Number Matches: | 1 |
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