是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA16,4X4,20 | 针数: | 16 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 1.38 |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | S-PBGA-B16 |
长度: | 2 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA16,4X4,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 0.67 mm | 子类别: | Other Interface ICs |
最大供电电压: | 3.2 V | 最小供电电压: | 1.62 V |
标称供电电压: | 1.8 V | 电源电压1-最大: | 3.6 V |
电源电压1-分钟: | 2.2 V | 电源电压1-Nom: | 3.3 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX13035EEBE+ | MAXIM |
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