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MADS-002545-1307LG PDF预览

MADS-002545-1307LG

更新时间: 2024-11-24 05:48:15
品牌 Logo 应用领域
泰科 - TE 肖特基二极管
页数 文件大小 规格书
3页 60K
描述
SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip

MADS-002545-1307LG 数据手册

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MADS-002545-1307 Series  
SURMOUNTTM Schottky Diodes:  
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip  
M/A-COM Products  
Rev. V3  
Features  
Ultra Low Parasitic Capacitance and Inductance  
Surface Mountable in Microwave Circuits , No  
Wire bonds Required  
Rugged HMIC Construction with Polyimide  
Scratch Protection  
Reliable, Multilayer Metallization with a Diffusion  
Barrier, 100% Stabilization Bake (300 °C, 16 hours)  
Lower Susceptibility to ESD Damage  
Description and Applications  
The MADS-002545-1307 Series Surmount  
Silicon Schottky Cross-Over Quad Diodes are fabri-  
cated with the patented Heterolithic Microwave Inte-  
grated Circuit (HMIC) process. HMIC circuits consist of  
Silicon pedestals which form diodes or via conductors em-  
bedded in a glass dielectric, which acts as the low disper-  
sion, low loss, microstrip transmission medium. The combi-  
nation of silicon and glass allows HMIC devices to have  
excellent loss and power dissipation characteristics in a low  
profile, reliable device.  
These Surmount Schottky devices are excellent  
choices for circuits requiring the small parasitics of a  
beam lead device coupled with the superior mechanical per-  
formance of a chip. The Surmount structure employs very low  
resistance silicon vias to connect the Schottky contacts to the  
metalized mounting pads on the bottom surface of the  
chip. These devices are reliable, repeatable, and a  
lower cost performance solution to conventional de-  
vices. They have lower susceptibility to electrostatic  
discharge than conventional beam lead Schottky di-  
odes.  
Case Style 1307  
The multi-layer metallization employed in the fabrication of the  
Surmount Schottky junctions includes a platinum diffu-  
sion barrier, which permits all devices to be subjected to a 16-  
hour non-operating stabilization bake at 300°C.  
The “ 0202 ” outline allows for Surface Mount placement and  
multi- functional polarity orientations. The MADS-002545-1307  
Series is recommended for use in microwave circuits through  
Ku band frequencies for lower power applications such as mix-  
ers, sub-harmonic mixers, detectors and limiters. The HMIC  
construction facilitates the direct replacement of more fragile  
beam lead diodes with the corresponding Surmount diode,  
which can be connected to a hard or soft substrate circuit with  
solder.  
Dim  
Inches  
Millimeters  
Min.  
Max.  
Min.  
Max.  
A
B
0.023  
0.025  
0.575  
0.625  
0.023  
0.004  
0.007  
0.007  
0.025  
0.008  
0.009  
0.009  
0.575  
0.102  
0.175  
0.175  
0.625  
0.203  
0.225  
0.225  
C
D Sq.  
E Sq.  
1
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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