Datasheet > MA001389456_15

MA001389456_15

更新时间： 2024-11-25 00:41:03

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英飞凌 - INFINEON		/
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Material Content Data Sheet

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MA001389456_15 数据手册

Material Content Data Sheet

Sales Product Name BSC082N10LS G

Issued

19. February 2015

122.78 mg

MA#

MA001337748

PG-TDSON-8-1

Package

Weight*

Average

Mass

[%]

Average

Sum

CAS#

Weight

[mg]

Sum

Construction Element

Material Group

Substances

Mass

[%]

[ppm]

if applicable

[ppm]

44126

308

chip

inorganic material

non noble metal

inorganic material

non noble metal

organic material

plastics

silicon

7440-21-3

7439-89-6

7723-14-0

7440-50-8

1333-86-4

5.418

0.038

0.011

37.762

0.078

5.529

33.329

1.452

0.166

0.101

0.081

3.868

1.289

0.011

0.003

11.320

0.022

0.007

22.292

4.41

0.03

0.01

30.76

0.06

4.50

27.15

1.18

0.13

0.08

0.07

3.15

1.05

0.01

0.00

9.22

0.02

0.01

18.16

4.41

44126

leadframe

iron

phosphorus

copper

carbon black

epoxy resin

silicondioxide

tin

30.80

307565

634

307965

encapsulation

45032

271458

11824

1348

825

inorganic material

non noble metal

noble metal

60676-86-0

7440-31-5

7440-22-4

7440-31-5

7439-92-1

7440-22-4

7439-89-6

7723-14-0

7440-50-8

7439-89-6

7723-14-0

7440-50-8

31.71

1.18

0.13

317124

11824

1348

leadfinish

plating

silver

solder

noble metal

silver

non noble metal

noble metal

tin

660

lead

3.30

1.05

31505

10502

32990

10502

CLIP plating

heatspreader

silver

non noble metal

inorganic material

non noble metal

inorganic material

non noble metal

< 10%

iron

phosphorus

copper

iron

9.23

92201

182

92321

heat sink CLIP

*deviation

phosphorus

copper

18.19

181563

181800

Sum in total: 100.00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption

7a, Lead in high melting temperature type solders.

Company

Address

Internet

Infineon Technologies AG

81726 München

www.infineon.com

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