Material Content Data Sheet
Sales Product Name BSC010N04LSI
Issued
2. June 2015
119.16 mg
MA#
MA000974064
Package
PG-TDSON-8-17
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
silicon
iron
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
1.517
0.038
0.011
37.762
0.044
0.086
6.079
36.646
1.470
0.166
0.053
0.042
2.010
0.003
0.013
0.269
10.909
0.007
0.026
0.529
21.482
1.27
0.03
0.01
31.70
0.04
0.07
5.10
30.75
1.23
0.14
0.04
0.04
1.69
0.00
0.01
0.23
9.15
0.01
0.02
0.44
18.03
1.27
12733
317
12733
leadframe
phosphorus
copper
gold
95
31.74
0.04
316892
373
317304
373
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
719
51015
307530
12334
1389
442
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
35.92
1.23
0.14
359264
12334
1389
leadfinish
plating
silver
solder
noble metal
silver
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
tin
353
lead
1.77
9.39
16872
28
17667
93943
heatspreader
heat sink CLIP
*deviation
phosphorus
zinc
113
iron
2255
91547
55
copper
phosphorus
zinc
222
iron
4440
180276
copper
18.50
184993
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com