Material Content Data Sheet
Sales Product Name BSB012N03LX3 G
Issued
19. November 2015
MA#
MA000629688
Package
MG-WDSON-2-8
Weight*
86.37 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
non noble metal
noble metal
silicon
copper
nickel
7440-21-3
7440-50-8
7440-02-0
7440-22-4
7440-02-0
-
6.356
74.415
0.211
0.840
0.211
0.254
1.561
0.011
0.066
2.119
0.327
7.36
86.17
0.24
0.97
0.24
0.29
1.81
0.01
0.08
2.45
0.38
7.36
73594
861570
2445
9725
2445
2942
18071
127
73594
leadframe
leadfinish
86.17
861570
silver
1.21
0.24
12170
2445
plating
glue
non noble metal
plastics
nickel
epoxy resin
silver
noble metal
7440-22-4
7440-50-8
7440-22-4
7440-31-5
-
2.10
21013
solder
non noble metal
noble metal
copper
silver
763
non noble metal
plastics
tin
2.54
0.38
24528
3790
25418
3790
passivation
*deviation
epoxy resin
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com