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M74HC356F1 PDF预览

M74HC356F1

更新时间: 2024-09-30 14:53:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 双倍数据速率输入元件输出元件逻辑集成电路
页数 文件大小 规格书
6页 171K
描述
HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP20, FRIT SEALED, CERAMIC, DIP-20

M74HC356F1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP20,.3
针数:20Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01风险等级:5.27
其他特性:TRANSPARENT ADDRESS LATCHES; 3 ENABLE INPUTS; REGISTERED DATA INPUTS系列:HC/UH
JESD-30 代码:R-GDIP-T20JESD-609代码:e0
负载电容(CL):50 pF逻辑集成电路类型:MULTIPLEXER
最大I(ol):0.006 A功能数量:1
输入次数:8输出次数:1
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:COMPLEMENTARY封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP封装等效代码:DIP20,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:2/6 V
Prop。Delay @ Nom-Sup:74 ns传播延迟(tpd):66 ns
认证状态:Not Qualified座面最大高度:5 mm
子类别:Multiplexer/Demultiplexers最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

M74HC356F1 数据手册

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