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M60301LVSN12.6000MHZ PDF预览

M60301LVSN12.6000MHZ

更新时间: 2024-12-02 07:15:07
品牌 Logo 应用领域
MTRONPTI /
页数 文件大小 规格书
2页 300K
描述
Oscillator, 12.6MHz Nom,

M60301LVSN12.6000MHZ 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
Reach Compliance Code:unknown风险等级:5.84
JESD-609代码:e4安装特点:SURFACE MOUNT
端子数量:4标称工作频率:12.6 MHz
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装等效代码:DILCC4,.2,200
电源:3 V认证状态:Not Qualified
子类别:Other Oscillators最大压摆率:2.5 mA
标称供电电压:3 V表面贴装:YES
端子面层:Nickel/Gold (Ni/Au)

M60301LVSN12.6000MHZ 数据手册

 浏览型号M60301LVSN12.6000MHZ的Datasheet PDF文件第2页 
M6029 and M6030 Series  
5x7 mm, 3.0 Volt, Clipped Sinewave, TCXO/TCVCXO  
•ꢀ Miniature Size  
•ꢀ Ideal for handheld and portable devices  
DENOTES PIN 1  
Pin Connections  
RAMETER  
Symbol  
Min.  
Typ.  
Max.  
Units  
Condition/Notes  
quency Range  
erating Temperature  
rage Temperature  
quency Stability  
ng  
F
12.6  
26  
MHz  
TA  
(See Ordering Information)  
-30 +75  
(See Ordering Information)  
TS  
qC  
ǻF/F  
1st Year  
-1  
+1  
ppm  
ppm  
V
ppm/V  
V
@25qC  
@25qC  
M6030  
M6030  
Thereafter (per year)  
Control Voltage  
Tuning Range  
Input Voltage  
-1  
0.5  
±5  
+1  
Vc  
1.5  
3.0  
2.5  
±15  
3.15  
2.5  
Vdd  
Idd  
2.85  
Input Current  
mA  
Output Type  
Load  
Output Level  
Start up Time  
Phase Noise (Typical)  
Clipped Sinewave  
pk-pk  
10 ohms || 10pF  
5
100 Hz 100 Hz 1 kHz  
-80 -110 -130  
0.8  
V
ms  
10 kHz Offset from carrier  
-145 dBc/Hz  
Shock  
MIL-STD-202, Method 213, Condition C 100 g  
10 g from 10 to  
2000 Hz  
Vibration  
MIL-STD-202, Method 201 & 204  
Solderability  
EIAJ-STD-002  
Max Soldering Conditions  
See solder profile, Figure 1  
Clipped Sinewave Load – see load circuit diagram #7.  
MtronPTI reserves the right to make changes to the product(s) and service(s) described herein without notice. No liability is assumed as a result of their use or application.  
Please see www.mtronpti.com for our complete offering and detailed datasheets. Contact us for your application specific requirements: MtronPTI 1-800-762-8800.  
Revision: 3-13-08  

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