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M29F002NT-70P1 PDF预览

M29F002NT-70P1

更新时间: 2024-01-06 11:14:37
品牌 Logo 应用领域
恒忆 - NUMONYX 可编程只读存储器光电二极管内存集成电路
页数 文件大小 规格书
29页 233K
描述
256KX8 FLASH 5V PROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

M29F002NT-70P1 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:DIP包装说明:DIP, DIP32,.6
针数:32Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.28最长访问时间:70 ns
其他特性:20 YEARS DATA RETENTION; 100000 PROGRAM/ERASE CYCLES; TOP BOOT BLOCK启动块:TOP
命令用户界面:YES数据轮询:YES
数据保留时间-最小值:20耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDIP-T32JESD-609代码:e0
长度:41.91 mm内存密度:2097152 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:1,2,1,3
端子数量:32字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX8封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP32,.6
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL电源:5 V
编程电压:5 V认证状态:Not Qualified
座面最大高度:5.08 mm部门规模:16K,8K,32K,64K
最大待机电流:0.0001 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL切换位:YES
类型:NOR TYPE宽度:15.24 mm
Base Number Matches:1

M29F002NT-70P1 数据手册

 浏览型号M29F002NT-70P1的Datasheet PDF文件第1页浏览型号M29F002NT-70P1的Datasheet PDF文件第2页浏览型号M29F002NT-70P1的Datasheet PDF文件第4页浏览型号M29F002NT-70P1的Datasheet PDF文件第5页浏览型号M29F002NT-70P1的Datasheet PDF文件第6页浏览型号M29F002NT-70P1的Datasheet PDF文件第7页 
M29F002T, M29F002NT, M29F002B  
Table 2. Absolute Maximum Ratings (1)  
Symbol  
TA  
Parameter  
Value  
–40 to 125  
–50 to 125  
–65 to 150  
–0.6 to 7  
Unit  
Ambient Operating Temperature (3)  
Temperature Under Bias  
Storage Temperature  
C
°
C
°
C
°
TBIAS  
TSTG  
(2)  
VIO  
Input or Output Voltages  
Supply Voltage  
V
V
V
VCC  
–0.6 to 7  
(2)  
V(A9, E, G, RPNC)  
A9, E, G, RPNC Voltage  
–0.6 to 13.5  
Notes: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings"  
may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other  
conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum  
Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other  
relevant quality documents.  
2. Minimum Voltage may undershoot to –2V during transition and for less than 20ns.  
3. Depends on range.  
Organisation  
from or program to any block not being ersased,  
and then resumed. Block protection provides addi-  
tional data security. Each block can be separately  
protected or unprotected against Program or Erase  
on programming equipment. All previously pro-  
tected blocks can be temporarily unprotected in the  
application.  
The M29F002 is organised as 256K x 8. Memory  
control isprovided byChip EnableE, OutputEnable  
G and Write Enable W inputs.  
A Reset/Block Temporary Unprotection RPNC  
(NOT available on M29F002NT) tri-level input pro-  
vides a hardware reset when pulled Low, and when  
held High (at VID) temporarily unprotects blocks  
previously protected allowing them to be progra-  
med and erased. Erase and Program operations  
are controlled by an internal Program/Erase Con-  
troller (P/E.C.).Status Register data output on DQ7  
provides a Data Polling signal, and DQ6 and DQ2  
provide Toggle signals to indicate the state of the  
P/E.C operations.  
Bus Operations  
The following operations can be performed using  
the appropriate bus cycles: Read (Array, Electronic  
Signature, Block Protection Status), Write com-  
mand, Output Disable, Standby, Reset, Block Pro-  
tection, Unprotection, Protection Verify,  
UnprotectionVerifyandBlockTemporaryUnprotec-  
tion. See Tables 4 and 5.  
Memory Blocks  
Command Interface  
The devices feature asymmetrically blocked archi-  
tecture providing system memory integration. The  
M29F002 has an array of 7 blocks, one Boot Block  
of 16 KBytes, two Parameter Blocks of 8 KBytes,  
one Main Block of 32 KBytes and three Main Blocks  
of 64 KBytes.  
Instructions, made up of commands written in cy-  
cles, can be given to the Program/Erase Controller  
through a Command Interface (C.I.). For added  
data protection, program or erase execution starts  
after 4 or 6 cycles.The first, second, fourth and fifth  
cycles are used to input Coded cycles to the C.I.  
This Coded sequence is the same for all Pro-  
gram/EraseControllerinstructions.TheCommand’  
itself and its confirmation, when applicable, are  
given on the third, fourth or sixth cycles. Any incor-  
rect command or any improper command se-  
quence will reset the device to Read Array mode.  
The memory map is shown in Figure 3. Each block  
can be erased separately, any combination of  
blocks can be specified for multi-block erase or the  
entire chip may be erased. The Erase operations  
are managed automatically by the P/E.C.The block  
erase operation can be suspended in order to read  
3/29  

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