是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | LCC |
包装说明: | QCCN, | 针数: | 36 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.44 | JESD-30 代码: | S-CQCC-N36 |
JESD-609代码: | e3 | 长度: | 8.99 mm |
功能数量: | 1 | 端子数量: | 36 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | QCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 3.1 mm | 标称供电电压: | 3.3 V |
表面贴装: | YES | 电信集成电路类型: | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | NO LEAD | 端子节距: | 0.635 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 8.99 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M2066-13I627.3296 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I627.3296LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I644.5313LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I666.5143 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I666.5143LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I669.1281LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I669.3120LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-13I669.3266 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2067-11-622.0800 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2067-11-625.0000 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 |