是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | LCC |
包装说明: | QCCN, | 针数: | 36 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.26 | 应用程序: | SONET;SDH |
JESD-30 代码: | S-CQCC-N36 | JESD-609代码: | e0 |
长度: | 8.99 mm | 功能数量: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | QCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 3.1 mm |
标称供电电压: | 3.3 V | 表面贴装: | YES |
电信集成电路类型: | ATM/SONET/SDH SUPPORT CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | NO LEAD |
端子节距: | 0.635 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 8.99 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M2066-11I666.5143 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I666.5143LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I669.1281 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I669.1281LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I669.3120LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I669.6429 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I669.6429LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I670.8386LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I672.1600 | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 | |
M2066-11I672.1600LF | IDT |
获取价格 |
Support Circuit, 1-Func, CQCC36, 9 X 9 MM, CERAMIC, LCC-36 |