ESMT
M12L128168A (2N)
Automotive Grade
PIN CONFIGURATION (TOP VIEW)
BALL CONFIGURATION (TOP VIEW)
(TSOPII 54L, 400milX875mil Body, 0.8mm Pin Pitch)
(BGA 54, 8mmX8mmX1mm Body, 0.8mm Ball Pitch)
PIN DESCRIPTION
PIN
NAME
System Clock
INPUT FUNCTION
CLK
CS
Active on the positive going edge to sample all inputs
Disables or enables device operation by masking or enabling all
inputs except CLK , CKE and L(U)DQM
Chip Select
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior new command.
Disable input buffers for power down in standby.
Clock Enable
CKE
Row / column address are multiplexed on the same pins.
Row address : RA0~RA11, column address : CA0~CA8
A0 ~ A11
Address
Selects bank to be activated during row address latch time.
Selects bank for read / write during column address latch time.
BA0 , BA1
Bank Select Address
Latches row addresses on the positive going edge of the CLK with
RAS low. (Enables row access & precharge.)
Row Address Strobe
Column Address Strobe
Write Enable
RAS
Latches column address on the positive going edge of the CLK with
CAS low. (Enables column access.)
CAS
Enables write operation and row precharge.
WE
Latches data in starting from CAS , WE active.
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
L(U)DQM
Data Input / Output Mask
DQ0 ~ DQ15
VDD / VSS
Data Input / Output
Data inputs / outputs are multiplexed on the same pins.
Power and ground for the input buffers and the core logic.
Power Supply / Ground
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
VDDQ / VSSQ
NC
Data Output Power / Ground
No Connection
This pin is recommended to be left No Connection on the device.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jun. 2012
Revision: 1.1
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