Datasheet > LZ-9ES-HV-UC

LZ-9ES-HV-UC

更新时间： 2023-07-15 00:00:00

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LZ-9ES-HV-UC 数据手册

FTR-K1 SERIES

JV SERIES

LZ SERIES

RoHS Compliance and Lead Free Information

1. General Information

All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including

amendments.

Cadmium as used in electrical contacts is exempted from the RoHS directives.

As per Annex III of directive 2011/65/EU.

All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:

http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf

Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.

This material has been verified to be compatible with PbSn assembly process.

2. Recommended Lead Free Solder Condition

Recommended solder Sn-3.0Ag-0.5Cu.

Flow Solder Condition:

Pre-heating:ꢀ

maximumꢀ120˚C

within 90 sec.

Soldering:

dip within 5 sec. at

255˚Cꢀ±ꢀ5˚Cꢀsolderꢀbath

ꢀ

Relay must be cooled by air immediately

after soldering

Solder by Soldering Iron:

Soldering Iron 30-60W

Temperature:ꢀ maximumꢀ350-360˚C

Duration:

maximum 3 sec.

We highly recommend that you conﬁrm your actual solder conditions

3. Moisture Sensitivity

Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.

4. Tin Whiskers

Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length

whisker was found by our in house test.

1...6 7 8910

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