是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | QFN |
包装说明: | HVQCCN, LCC16,.16SQ,25 | 针数: | 16 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.13 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-PQCC-N16 | JESD-609代码: | e0 |
长度: | 4 mm | 湿度敏感等级: | 1 |
信道数量: | 3 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC16,.16SQ,25 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 235 | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
子类别: | Power Management Circuits | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.35 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 4 mm | Base Number Matches: | 1 |
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