Datasheet > LS1046AXE8Q1A

LS1046AXE8Q1A

更新时间： 2024-03-03 10:08:44

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
194页	2019K
描述
Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.6GHz, -40 to 105C, Security enabled

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LS1046AXE8Q1A 数据手册

Package information

The system board designer can choose among several types of commercially available

thermal interface materials.

7 Package information

7.1 Package parameters for the FC-PBGA

The package parameters are as provided in the following list. The package type is 23 mm

x 23 mm, 780 flip-chip, plastic-ball, grid array.

• Package outline - 23 mm x 23 mm

• Interconnects - 780

• Ball Pitch - 0.8 mm

• Ball Diameter (nominal) - 0.45 mm

• Ball Height (nominal) - 0.3 mm

• Solder Balls Composition - 96.5% Sn, 3% Ag, and 0.5% Cu

• Module height (typical) - 2.31 (minimum), 2.46 mm (typical), and 2.61 mm

(maximum)

7.2 Mechanical dimensions of the FC-PBGA

This figure shows the mechanical dimensions and bottom surface nomenclature of the

chip.

QorIQ LS1046A, LS1026A Data Sheet, Rev. 4, 06/2020

188

NXP Semiconductors

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型号	品牌	描述	获取价格	数据表
LS1046AXE8T1A	NXP	Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.8GHz, -40 to 105C, Security enabled	获取价格
LS1046AXN8P1A	NXP	Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.4GHz, -40 to 105C, Security disabled	获取价格
LS1046AXN8Q1A	NXP	Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.6GHz, -40 to 105C, Security disabled	获取价格
LS1046AXN8T1A	NXP	Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.8GHz, -40 to 105C, Security disabled	获取价格
LS1048ASE7MQA	NXP	Multifunction Peripheral	获取价格
LS1048ASE7PTA	NXP	Multifunction Peripheral	获取价格