Datasheet > LQM2MPN3R3G0L

LQM2MPN3R3G0L

更新时间： 2024-01-19 23:54:42

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
48页	2409K
描述
High-performance class-G stereo headphone amplifier with I2C volume control

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LQM2MPN3R3G0L 数据手册

TS4621B

High-performance class-G stereo headphone amplifier

with I²C volume control

Features

TS4621BEIJT - flip-chip

■ Power supply range: 2.3 V to 4.8 V

■ 0.6 mA/channel quiescent current

■ 2.1 mA current consumption with

100 µW/channel (10 dB crest factor)

■ 0.006% typical THD+N at 1 kHz

■ 100 dB typical PSRR at 217 Hz

■ 100 dB of SNR A-weighted at G = 0 dB

■ Zero pop and click

Pinout (top view)

INR-

INR+

INL+

VOUTR

SCL

SDA

CMS

PVSS

■ I C interface for volume control

HPVDD

AGND

■ Digital volume control range from -60 dB to

+4 dB

INL-

VOUTL

AVDD

■ Independent right and left channel shutdown

control

■ Integrated high-efficiency step-down converter

■ Low software standby current: 5 µA max

■ Output-coupling capacitors removed

■ Thermal shutdown

Balls are underneath

When powered by a battery, the internal step-

down DC/DC converter generates the appropriate

voltage to the amplifier depending on the

amplitude of the audio signal to supply the

headsets. It achieves a total 2.1 mA current

consumption at 100 µW output power (10 dB

crest factor).

■ Flip-chip package: 1.65 mm x 1.65 mm,

400 µm pitch, 16 bumps

Applications

THD+N is 0.02 % maximum at 1 kHz and PSRR

is 100 dB at 217 Hz, which ensures a high audio

quality of the device in a wide range of

environments.

■ Cellular phones, smart phones

■ Mobile internet devices

■ PMP/MP3 players

The traditionally bulky output coupling capacitors

can be removed.

Description

A dedicated common-mode sense pin removes

parasitic ground noise.

The TS4621B is a class-G stereo headphone

driver dedicated to high audio performance, high

power efficiency and space-constrained

applications.

The TS4621B is designed to be used with an

output serial resistor. It ensures unconditional

stability over a wide range of capacitive loads.

It is based on the core technology of a low power

dissipation amplifier combined with a high-

efficiency step-down DC/DC converter for

supplying this amplifier.

The TS4621B is packaged in a tiny 16-bump

flip-chip package with a pitch of 400 µm.

September 2011

Doc ID 022194 Rev 2

1/48

www.st.com

12 3 4 5 6 7...48

中文翻译

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