Datasheet > LQM2HPNR24MCH#

LQM2HPNR24MCH#

更新时间： 2023-09-03 20:31:12

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LQM2HPNR24MCH# 数据手册

Spec No.: JELF243B_0076D-01

P6/9

12.1 Land dimensions

The following diagram shows the recommended land dimensions for soldering:

Ｃｈｉｐｃｏｉｌ

Chip Ferrite Bead

Pattern thickness and

dimension d

Applied

current (A)

18 μm 35 μm 70 μm

0 to 1.5

1.6 3.0 1.5 1.5

1.5

1.5 to 3.0 1.6 3.0 1.5 3.0

1.5

(in mm)

Solder Resist

Pattern

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

MURATA MFG CO., LTD

1...3 4 567 8 9

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