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LQM18NN47NM00# PDF预览

LQM18NN47NM00#

更新时间: 2023-09-03 20:28:20
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村田 - MURATA /
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9页 152K
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LQM18NN47NM00# 数据手册

 浏览型号LQM18NN47NM00#的Datasheet PDF文件第3页浏览型号LQM18NN47NM00#的Datasheet PDF文件第4页浏览型号LQM18NN47NM00#的Datasheet PDF文件第5页浏览型号LQM18NN47NM00#的Datasheet PDF文件第7页浏览型号LQM18NN47NM00#的Datasheet PDF文件第8页浏览型号LQM18NN47NM00#的Datasheet PDF文件第9页 
Reference Only  
Spec No. JELF243B-0003S-01  
Soldering profile  
P.6/10  
(1) Flow soldering profile  
Temp.  
(℃)  
265℃±3℃  
250℃  
Limit Profile  
150  
Heating Time  
Standard Profile  
60s min.  
Time.(s)  
Standard Profile  
150, 60s min.  
Limit Profile  
Pre-heating  
Heating  
Cycle of flow  
250, 4s6s  
2 times  
265±3, 5s  
2 times  
(2) Reflow soldering profile  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150°C180°C, 90s±30s  
Heating  
Peak temperature  
Cycle of reflow  
above 220°C, 30s60s  
above 230°C, 60s max.  
260°C, 10s  
245°C±3°C  
2 times  
2 times  
11.4 Reworking with soldering iron.  
The following conditions must be strictly followed when using a soldering iron.  
Pre-heating  
150°C, 1 min  
350°C max.  
80W max.  
φ3mm max.  
3(+1, -0)s  
Tip temperature  
Soldering iron output  
Tip diameter  
Soldering time  
Time  
2 times  
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack  
on the products due to the thermal shock.  
11.5 Solder Volume  
Solder shall be used not to be exceed the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
Upper Limit  
Recommendable  
t
1/3TtT  
Tthickness of product  
MURATA MFG.CO., LTD  

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