Reference Only
Spec No. JELF243B-0003S-01
No. Item
P.3/10
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Test Method
7.4 Solderability
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Appearance: No damage
Inductance Change: within ±10%
Q Change: within ±20%
Test Method
Temperature: 85°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
Temperature: -40°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: +85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 48h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
2.0±0.05
0.1
0
1.5±
φ
4.0±0.1 4.0±0.1
Direction of feed
1.1 max.
1.05±0.1
(in mm)
MURATA MFG.CO., LTD