Datasheet > LQM18NN1R0K00#

LQM18NN1R0K00#

更新时间： 2023-09-03 20:28:20

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村田 - MURATA		/
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LQM18NN1R0K00# 数据手册

Reference Only

Spec No. JELF243B-0003S-01

P.7/10

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length: a‹b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

D *1

Perforation

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component in a position as far away from the screw holes

as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

Frequency : 28kHz to 40kHz

Time : 5 min max.

MURATA MFG.CO., LTD

1...4 5 678 9

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