Reference Only
Spec No. JELF243B-0003S-01
Soldering profile
P.6/10
(1) Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
150℃, 60s min.
Limit Profile
Pre-heating
Heating
Cycle of flow
250℃, 4s~6s
2 times
265℃±3℃, 5s
2 times
(2) Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C~180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s~60s
above 230°C, 60s max.
260°C, 10s
245°C±3°C
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1, -0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceed the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
t
1/3T≦t≦T
T: thickness of product
MURATA MFG.CO., LTD