SpecNo.JELF243A-0164B-01
P5/10
8. Environmental Performance (It shall be soldered on the substrate.)
No.
Item
Specification
Test Method
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance:No damage
Inductance Change:within ± 5%
Q-factor Change:within ± 20%
Temperature:85±2°C
Time:1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
Temperature:-40±2°C
Time:1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
Temperature:40±2°C
Humidity:90 to 95%(RH)
Time:1000h (+48 h, -0 h)
Then measured after exposure in the room
condition for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
step 1:-40±2°C / 30±3 min
step 2:Ordinary temp. / 10 to 15 min
step 3:+85±2°C / 30±3 min
step 4:Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
1.5
-0
Lead-in/out wire
※
(0.3)
0.3±0.05
The packing directions of the chip coil
※
in taping are unified with the in/out
positions of the lead wire.
4.0±0.1
8.0±0.1
2.7±0.2
3.6±0.1
3.6
2.0±0.05
Direction of feed
(in mm)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
500 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
MURATA MFG.CO., LTD