Spec No.: JELF243A_0121J-01
P6/9
11.
Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
equipment
(4) Power plant
control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, (7) Traffic signal
trains, ships, etc.) equipment
(8) Disaster/crime
prevention
equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or reliability
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
11.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
(in mm)
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
MURATA MFG CO., LTD
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