Datasheet > LQH32CHR15M33#

LQH32CHR15M33#

更新时间： 2023-09-03 20:28:04

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LQH32CHR15M33# 数据手册

SpecNo.JELF243A-9121B-01

P6/7

Reference Only

(2)Reflow soldering profile

Temp.

(℃)

260℃

245℃±3℃

230℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

1 time

10.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

10.5 Solder Volume

･ Solder shall be used not to be exceeded the upper limits as shown below.

･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

(T: Lower flange thickness)

10.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Electrode

Products shall be located in the sideways

direction (Length:a<b) to the mechanical

stress.

(Good example)

(Poor example)

Electrode

MURATA MFG.CO., LTD

1...3 4 567 8

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