5秒后页面跳转
LQH2HPN2R2MJR# PDF预览

LQH2HPN2R2MJR#

更新时间: 2023-09-03 20:26:34
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
9页 396K
描述

LQH2HPN2R2MJR# 数据手册

 浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第3页浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第4页浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第5页浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第6页浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第8页浏览型号LQH2HPN2R2MJR#的Datasheet PDF文件第9页 
Spec No.: JELF243A_0119K-01  
P7/9  
12.4 Reworking with soldering iron  
The following requirements must be met to rework a soldered product using a soldering iron.  
Item  
Requirement  
150°C/approx. 1 min  
350°C max.  
Pre-heating  
Tip temperature of soldering iron  
Power consumption of soldering iron  
Tip diameter of soldering iron  
Soldering time  
80 W max.  
ø3 mm max.  
3 s (+1 s, -0 s)  
2 times max.  
Number of reworking operations  
* Avoid a direct contact of the tip of the soldering iron with the product. Such a  
direction contact may cause cracks in the ceramic body due to thermal shock.  
12.5 Solder volume  
Solder shall be used not to increase the volume too much.  
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of  
mechanical or electrical performance.  
12.6 Product's location  
The following shall be considered when designing and laying out PCBs.  
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.  
[Products direction]  
Products shall be located in the sideways direction to the mechanical stress.  
Electrode  
(Good example)  
(Poor example)  
Electrode  
(2) Components location on PCB separation  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce  
stress.  
Contents of measures  
Stress level  
A > D*1  
A > B  
(1) Turn the mounting direction of the component parallel to the  
board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the  
board separation surface.  
A > C  
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.  
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
C
Perforation  
B
Electrode  
D
A
Slit  
Electrode  
(3) Mounting components near screw holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the  
tightening of the screw.  
Mount the component in a position as far away from the screw holes as possible.  
MURATA MFG CO., LTD  

与LQH2HPN2R2MJR#相关器件

型号 品牌 描述 获取价格 数据表
LQH2HPN2R2MM0# MURATA When rated current is applied to the products

获取价格

LQH2HPN3R3MDR# MURATA

获取价格

LQH2HPN3R3MDRL MURATA General Purpose Inductor,

获取价格

LQH2HPN3R3MG0L MURATA Chip Inductor Power Inductor

获取价格

LQH2HPN3R3MGR# MURATA

获取价格

LQH2HPN3R3MGRL MURATA General Purpose Inductor,

获取价格